QML Class V designation acknowledges distinctive reliability and longevity for essential house missions Satisfying mission assurance necessities for essentially the most essential house applications, Microchip Know-how’s Radiation-Tolerant (RT) RTG4 Subject- Programmable Gate Arrays (FPGAs) with lead-free flip-chip bumps have earned the Certified Producers Record (QML) Class V standing. As designated by the Protection Logistics Company (DLA), QML Class V is the best degree of qualification for house elements and a crucial step to fulfill mission assurance necessities on essentially the most essential house missions similar to human-rated, deep house and nationwide safety applications. As a result of QML {qualifications} are standardized primarily based on particular efficiency and high quality necessities ruled by the DLA, prospects can streamline their design and certification processes by utilizing QML- certified merchandise.
In 2018, RTG4 FPGAs turned the primary RT FPGAs providing greater than 150,000 logic parts to realize a QML Class V qualification, and this next-generation resolution with lead-free flip-chip bumps is the primary of its type to realize QML Class V standing. In superior flip-chip package deal building, similar to that used within the RTG4 FPGA, flip-chip bumps are utilized to attach the silicon die and the package deal substrate. Lead- free bump materials will assist prolong the longevity of the product, which is essential to house missions.
“That is one other milestone for our RTG4 FPGAs that may present prospects with added confidence in designing these gadgets in house flight programs, whereas permitting them to benefit from our high- reliability, zero-configuration-upset and low-power consumption FPGAs,” mentioned Bruce Weyer, company vice chairman for Microchip’s FPGA enterprise unit. “For greater than 60 years, Microchip options have powered house flight missions, and we’re devoted to product longevity and offering the best high quality options.”
RTG4 FPGAs are designed to carry excessive ranges of density and efficiency to house purposes, saving price and engineering efforts by low energy consumption and immunity to configuration upsets. In contrast to SRAM-based FPGA alternate options, the programming know-how utilized in RTG4 FPGAs gives low static energy, which assists in managing thermal points widespread in spacecraft. RTG4 FPGAs devour solely a fraction of the entire energy in comparison with equal SRAM FPGAs, whereas exhibiting zero configuration upsets in radiation and thus requiring no mitigation, decreasing engineering bills and whole system prices.
To realize QML Class V qualification, the RTG4 FPGA with lead-free bump has undergone intensive reliability testing, enduring as much as 2,000 thermal cycles from −65ºC to 150°C junction temperature. The lead-free flip-chip bump interface connections handed MIL-PRF-38535 inspection standards and exhibited no indicators of tin whiskers. The flip-chip bump is contained in the FPGA package deal, so there isn’t any affect on the consumer’s design, reflow profile, thermal administration or board meeting circulate when changing to lead-free bump RTG4 FPGAs.
Microchip boasts one of many business’s most complete house product portfolios of radiation- hardened and RT options that embody QML Class Q RT PolarFire FPGAs and sub-QML FPGAs that bridge the hole between conventional Certified Producers Record (QML) elements and Business Off-The- Shelf (COTS) elements. For a complete itemizing of Microchip FPGA and mixed-signal half numbers alongside their corresponding Protection Logistics Company (DLA) drawing numbers, please consult with the DLA Cross Reference Information.
Improvement Instruments
The RTG4 FPGAs are supported by growth kits, mechanical samples and daisy chain packages for board validation and testing. Libero SoC Design Suite allows RTL entry by programming and features a wealthy IP library, full reference designs and growth kits.
